КОМПЮТЪРНИ КОМПОНЕНТИ

Motherboard ASRock B660M-HDV, LGA1700, DDR4, mATX

ASRock B660M-HDV - Motherboard - micro ATX - LGA1700 Socket - B660 Chipset - USB-C Gen1, USB 3.2 Gen 1 - Gigabit LAN - onboard graphics (CPU required) - HD Audio (8-channel)

B660M-HDV

• Supports 12th Gen Intel^® Core™ Processors (LGA1700)
• 6 Phase Power Design
• Supports DDR4 5066MHz (OC)
• 1 PCIe 4.0 x16, 2 PCIe 3.0 x1
  1 M.2 Key-E for WiFi
• Graphics Output Options: HDMI, DisplayPort, D-Sub
• Realtek ALC887/897 7.1 CH HD Audio Codec, Nahimic Audio
• 4 SATA3
  1 Hyper M.2 (PCIe Gen4 x4)
  1 Ultra M.2 (PCIe Gen3 x4 & SATA3)
• 6 USB 3.2 Gen1 (3 Rear, 1 Rear Type-C, 2 Front)
  5 USB 2.0 (2 Rear, 3 Front)
• Intel^® Gigabit LAN

Дънна платка ASUS TUF GAMING B660M-PLUS D4, LGA 1700 mATX, 4x DDR4, Dual M.2, Aura Sync RGB

TUF GAMING B660M-PLUS D4

ASUS TUF GAMING B660M-PLUS D4 взема всички основни елементи на най-новите процесори на Intel и ги комбинира
с готови за игри функции и доказана издръжливост.Проектирана с компоненти от военен клас, подобрено решение
за захранване и всеобхватна система за охлаждане, тази дънна платка предлага стабилна и стабилна производителност
за маратонски игри.Естетически,TUF GAMING B660M-PLUS D4 носи логото на TUF Gaming и включва прости геометрични
елементи на дизайна, за да отрази надеждността и стабилността,които определят серията TUF Gaming.

• Supports 12th Gen Intel^® Core™ Series Processors​​
• Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs​​
• 6+2+1 Phases Hybrid Digital VRM with MOS Heatsink​
• WIFI 6 802.11ax 2T2R & BT5 with AERO Antenna​
• Fast 2.5 GbE LAN with Bandwidth Management​​
• Dual Ultra-Fast NVMe PCIe 4.0 x4 M.2 with Thermal Guard​​
• Rear SuperSpeed USB 3.2 Gen 2 TYPE-C^® for Fast and Versatile Connections ​​
• High Quality Audio Capacitors and Audio Noise Guard​
• RGB FUSION 2.0 supports Addressable LED & RGB LED Strips​​
• Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP​​
• Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card​​

 Дънна платка ASUS TUF GAMING X670E-PLUS WIFI - Motherboard - ATX - Socket AM5 - AMD X670 Chipset - USB 3.2 Gen 1, USB 3.2 Gen 2, USB-C Gen 2x2, USB-C 3.2 Gen2 - 2.5 Gigabit LAN, Wi-Fi, Bluetooth - onboard graphics (CPU required) - HD Audio (8-channel)

ASUS Prime X670-P - Motherboard - ATX - Socket AM5 - AMD X670 Chipset - USB 3.2 Gen 1, USB 3.2 Gen 2, USB-C Gen 2x2, USB-C 3.2 Gen 1 - 2.5 Gigabit LAN - onboard graphics (CPU required) - HD Audio (8-channel)

The ASUS ProArt X670E-Creator WiFi 6E perfects the art of performance, empowering creativity and maximizing the computing power of the latest AMD Ryzen 7000 series processors with powerful hardware and software, efficient cooling and lightning-fast connectivity, including USB 4, 10 Gb and 2.5 Gb onboard Ethernet, and WiFi 6E.

ASUS ROG Strix X670E-E Gaming WiFi 6E Socket AM5(LGA 1718) Ryzen 7000 ATX Gaming Motherboard(18+2 Power Stages,PCIe® 5.0,DDR,4xM.2 Slots,USB 3.2 Gen 2x2,WiFi 6E,PCIe Slot Q-Release, M.2 Q-Latch)

• Intelligent Control: ASUS-exclusive tools including AI Cooling II, Two-Way AI Noise-Cancelation and AI Networking for easy configuration
• Robust Power Solution: 18 + 2 teamed power stages with 8+8 pin ProCool II power connectors,high-quality alloy chokes and durable capacitors to support multi-core processors
• Optimized Thermal Design: Large VRM heatsinks plus integrated aluminum I/O cover,high-conductivity thermal pad, L-shaped heatpipe, M.2 Combo-sink and M.2 backplate for PCIe 5.0 M.2_1 slot, three on board M.2 heatsink
• High-Performance Networking: WiFi 6E, Intel 2.5 Gb Ethernet

ASUS ROG Strix X670E-A Gaming WiFi - Motherboard - ATX - Socket AM5 - AMD X670 Chipset - USB 3.2 Gen 1, USB 3.2 Gen 2, USB-C Gen 2x2, USB-C 3.2 Gen2 - 2.5 Gigabit LAN, Wi-Fi 6, Bluetooth - onboard graphics (CPU required) - HD Audio (8-channel)

• Robust Power Solution: 16 + 2 teamed power stages with 8+8 pin ProCool II power connectors, high-quality alloy chokes and durable capacitors to support multi-core processors
• Optimized Thermal Design: Massive VRM heatsinks plus aluminum I/O cover, high-conductivity thermal pad, four onboard M.2 heatsinks and one M.2 backplate for the M.2 - 1 slot
• Overclocking technologies: Dynamic OC Switcher, Ryzen Core Flex and PBO Enhancement - Extreme, and an intuitive UEFI BIOS dashboard
• High-Performance Networking: WiFi 6E, Intel 2.5 Gb Ethernet